Cleanroom Blog Articles

RTX’s Pratt & Whitney announces further capacity expansion at Singapore Manufacturing Facility

Pratt & Whitney announced a $20 million investment to grow its manufacturing capacity in Singapore for the production of Pratt & Whitney GTF™ engine high pressure turbine (HPT) disks.

SK hynix Unveils Roadmap for Use of Recycled Materials in Chip Production

SK hynix Inc. announced today that it has established a roadmap to actively utilize recycled1 and renewable2 materials in production, marking the first case that a semiconductor company lays out such mid- to long-term plan.

BAE Systems, Inc. and U.S. Dept. of Commerce announce first CHIPS and Science Act funding to modernize microelectronics facility

Biologics Modular today announced a significant milestone with respect to intellectual property, demonstrating its ongoing commitment to innovation and leadership of the modular cleanroom industry. The patent award encompasses the area where cleanroom modules are preassembled with air filtration systems already in place. Therefore, when transported to the customer, it arrives as a pretested system, whether it is one unit or a cleanroom made up of multiple units connected togethe

Toyota Advances Its Commitment To Vehicle Electrification

Toyota Advances its Commitment to vehicle electrification, Toyota will assemble three-row, battery electric SUV at Toyota Kentucky starting in 2025

SK hynix Unveils Roadmap for Use of Recycled Materials in Chip Production

SK hynix Unveils Roadmap for Use of Recycled Materials in Chip Production

SK hynix Inc. announced today that it has established a roadmap to actively utilize recycled1 and renewable2 materials in production, marking the first case that a semiconductor company lays out such mid- to long-term plan.

BAE Systems, Inc. and U.S. Dept. of Commerce announce first CHIPS and Science Act funding to modernize microelectronics facility

BAE Systems, Inc. and U.S. Dept. of Commerce announce first CHIPS and Science Act funding to modernize microelectronics facility

Biologics Modular today announced a significant milestone with respect to intellectual property, demonstrating its ongoing commitment to innovation and leadership of the modular cleanroom industry. The patent award encompasses the area where cleanroom modules are preassembled with air filtration systems already in place. Therefore, when transported to the customer, it arrives as a pretested system, whether it is one unit or a cleanroom made up of multiple units connected togethe

ILC Dover Secures North Carolina Facility to Expand Dry Repack Capabilities and Build Out cGMP Raw Materials Portfolio

ILC Dover Secures North Carolina Facility to Expand Dry Repack Capabilities and Build Out cGMP Raw Materials Portfolio

ILC Dover LP, specializing in innovative single-use solutions for biotherapeutics and pharmaceutical processing, has opened a new facility in Lillington, North Carolina to offer pre-filled trusted-weight cGMP raw materials for the growing biomanufacturing market.

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Biomerics Completes Connecticut Expansion

Biomerics Completes Connecticut Expansion

Biomerics, the leading vertically integrated medical device contract manufacturer in the interventional device market, announced completion of a 26,000 sq. ft. expansion of its Monroe, CT facility. The Monroe facility is the headquarters of Biomerics’ micro-metals processing business and specializes in the design, development, and manufacture of complex micromachined and laser-processed components for the interventional robotic medical device market.

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ADDMAN expands polymer additive and quick-turn capabilities via Dinsmore acquisition

ADDMAN expands polymer additive and quick-turn capabilities via Dinsmore acquisition

ADDMAN Engineering announced that it had acquired Dinsmore & Associates, Inc., an Irvine, California-based provider of polymer 3D printing services, to its manufacturing solutions network. The addition of Dinsmore broadens ADDMAN’s polymer production capability and is highly complementary to its existing additive and traditional manufacturing services.

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Allied Electronics & Automation Announces Ready-to-Ship Solutions for Medical Industry Applications

Allied Electronics & Automation Announces Ready-to-Ship Solutions for Medical Industry Applications

Allied Electronics & Automation, a trading brand of RS Group plc, a global omni-channel provider of product and service solutions, announces ready-to-ship solutions for medical industry applications from ABB Robotics, Bürkert Fluid Control Systems, Keystone Technologies, and MicroCare.

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Life Science Outsourcing Completes Acquisition of J-Pac Medical

Life Science Outsourcing Completes Acquisition of J-Pac Medical

Life Science Outsourcing, Inc., a leading contract manufacturer and value-added service provider to medical device and life science companies, announced today that it has acquired J-Pac Medical, a manufacturing, packaging and sterilization outsourcing partner to medical device and diagnostic companies.

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Cadence Announces the Acquisition of Utitec, Inc.

Cadence Announces the Acquisition of Utitec, Inc.

Cadence, Inc., a leading contract manufacturer of medical and drug delivery devices and specialty commercial products, announced today that it has acquired Utitec, Inc., a manufacturer specializing in miniature, deep drawn medical device and commercial components. Utitec is headquartered in Watertown, Conn., with an additional medical facility located in Alajuela, Costa Rica.

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ITRI Announces High Res Full-Color Micro LED Display for AR Glasses

ITRI Announces High Res Full-Color Micro LED Display for AR Glasses

ITRI, Taiwan’s largest and one of the world’s leading high-tech applied research institutions, today introduced the High Resolution Full-Color Micro LED Display for AR Glasses.

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AlixLabs AB announces their first European patent relating to Atomic Layer Etch Pitch Splitting (APS)

AlixLabs AB announces their first European patent relating to Atomic Layer Etch Pitch Splitting (APS)

AlixLabs from Lund, Sweden, has developed a new, innovative method for manufacturing semiconductor components with a high degree of packing, eliminating several steps in the semiconductor manufacturing process

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