by Intel
Intel Corporation will invest $3.5 billion to equip its New Mexico operations for the manufacturing of advanced semiconductor packaging technologies, including Foveros, Intel’s breakthrough 3D packaging technology. The multiyear investment is expected to create at least 700 high-tech jobs and 1,000 construction jobs and support an additional 3,500 jobs in the state. Planning activities begin immediately, with construction expected to start in late 2021.
by Cleanroom Connect Editor
Local and state governments invest about $100 million to build a micro-electronics clean room facility at the BRIDG center for advanced manufacturing research near Kissimmee, Florida. The facility is equipped with etchers, lasers, cleaners and printers for the manufacturing of semiconductors from silicon wafers. The new micro-electronics clean room facility will bring a new wave of high paying jobs to the local economy and will pave the road for future innovation in the semiconductor industry for Kissimmee, Florida.
by AMD
AMD today announced that it designed a semi-custom graphics processor unit (GPU) that will be integrated into a new Intel multi-chip processor package.
by Cleanroom Connect Editor
Chip Manufacturing in Semiconductor Cleanrooms Today silicon chips are everywhere. Intel creates industry-leading and world-first silicon products. These Intel® chips are some of the most complex devices ever manufactured, requiring advanced manufacturing technology....
