Biomerics, the leading vertically integrated contract manufacturer for the interventional medical device market, announced today that it has entered into definitive agreements to merge with Precision Concepts’ medical business (“Precision Concepts Medical”).
Allied Electronics & Automation, a trading brand of RS Group plc, a global omni-channel provider of product and service solutions, announces ready-to-ship solutions for medical industry applications from ABB Robotics, Bürkert Fluid Control Systems, Keystone Technologies, and MicroCare.
ITRI, Taiwan’s largest and one of the world’s leading high-tech applied research institutions, today introduced the High Resolution Full-Color Micro LED Display for AR Glasses.
The Semiconductor Industry Association (SIA) today announced worldwide sales of semiconductors were $44.5 billion in June 2021, an increase of 29.2% from the June 2020 total of $34.5 billion. Sales in June were 2.1% more than the May 2021 total of $43.6 billion. Sales during the second quarter of 2021 were $133.6 billion, an increase of 29.2% over the second quarter of 2020 and 8.3% more than the first quarter of 2021. Monthly sales are compiled by the World Semiconductor Trade Statistics (WSTS) organization and represent a three-month moving average. SIA represents 98% of the U.S. semiconductor industry by revenue and nearly two-thirds of non-U.S. chip firms.
Micron Technology, Inc., announced today it has begun volume shipments of the world’s first 176-layer NAND Universal Flash Storage (UFS) 3.1 mobile solution. Engineered for high-end and flagship phones, Micron’s discrete UFS 3.1 mobile NAND unlocks 5G’s potential with up to 75% faster sequential write and random read performance than prior generations,1 enabling downloads of two-hour 4K movies2 in as little as 9.6 seconds.
Picosun Group delivers cutting-edge Atomic Layer Deposition (ALD) technology to ams OSRAM for volume manufacturing of optical semiconductor devices…
ClassOne Technology, global provider of advanced semiconductor electroplating and surface preparation systems, announced that it has received multiple tool orders from one of the world’s largest RF device manufacturers…
GlobalFoundries (GF), the global leader in feature-rich semiconductor manufacturing, today announced its expansion plans for its most advanced manufacturing facility in upstate New York over the coming years. These plans include immediate investments to address the global chip shortage at its existing Fab 8 facility as well as construction of a new fab on the same campus that will double the site’s capacity.
As New York City begins its early phases of reopening since the onset of the pandemic, cleanroom design and construction services firm Precision Cleanrooms makes its claim in the Big Apple with its first New York City office in the company’s 32-year history. Located in Union Square at 41 East 11th Street, Precision Cleanrooms’ New York office will serve customers in greater New York and the extended Northeastern United States, providing turnkey cleanroom solutions and services for many industries including: pharmaceutical, biotech, medical device, and microelectronics industries.
GLOBALFOUNDRIES® (GF®), the global leader in feature-rich semiconductor manufacturing, today announced it is expanding its global manufacturing footprint with the construction of a new fab on its Singapore campus. In partnership with the Singapore Economic Development Board and with co-investments from committed customers, GF’s more than US $4B (S$5B) investment will play an integral role in meeting the growing demand for the company’s industry-leading manufacturing technologies and services to enable companies worldwide to develop and scale their business.
Intel Corporation will invest $3.5 billion to equip its New Mexico operations for the manufacturing of advanced semiconductor packaging technologies, including Foveros, Intel’s breakthrough 3D packaging technology. The multiyear investment is expected to create at least 700 high-tech jobs and 1,000 construction jobs and support an additional 3,500 jobs in the state. Planning activities begin immediately, with construction expected to start in late 2021.
It is a milestone on the path to the chip factory of the future: at the new Bosch semiconductor fab in Dresden, silicon wafers are passing through the fully automated fabrication process for the first time. This is a key step toward the start of production operations, which is scheduled for late 2021. Manufacturing of automotive microchips will be a primary focus when the fully digital and highly connected semiconductor plant is up and running. “Chips for tomorrow’s mobility solutions and greater safety on our roads will soon be produced in Dresden. We plan to open our chip factory of the future before the year is out,” says Harald Kroeger, member of the board of management of Robert Bosch GmbH. The company already operates a semiconductor fab in Reutlingen near Stuttgart. The new wafer fab in Dresden is Bosch’s response to the surging number of areas of application for semiconductors, as well as a renewed demonstration of its commitment to Germany as a high-tech location. Bosch is investing around one billion euros in the high-tech manufacturing facility, which will be one of the most advanced wafer fabs in the world. Funding for the new building is being provided by the federal German government, and more specifically the Federal Ministry for Economic Affairs and Energy. Bosch plans to officially open its wafer fab in June 2021.