Semiconductor Clean Room Industry Articles

First detailed electronic study of new nickelate superconductor

The answers could help advance the synthesis of new unconventional superconductors and their use for power transmission, transportation and other applications, and also shed light on how the cuprates operate – which is still a mystery after more than 30 years of research.

Bit5ive Is Appointed Official Distribution Partner Of Bitmain, The Multinational Fabless Hardware Manufacturer

Known as the global leaders in cryptocurrency mining and innovative turnkey solutions, Bit5ive LLC has been named official distribution partner of Bitmain, the industry-leading fabless manufacturer in computing chips, distributing antminers to over 30 countries in Latin and Central America plus the Caribbean. Those countries include Paraguay, Colombia, Argentina, Chile, Venezuela, Uruguay, Mexico and more.

Experience Mycronic comprehensive range of advanced electronics assembly technologies at APEX

Mycronic is leveraging its end-to-end expertise, software and solutions to unleash new levels in quality, ﬂexibility and productivity throughout the factory. At IPC APEX EXPO in San Diego 4-6 February, Mycronic will show a wide array of state-of-the-art assembly technologies that will help improve quality, flexibility and productivity in electronics manufacturing, including new advances in machine-to-machine communication, machine learning, full SMT line capabilities and automated material handling systems.

EV Group and DELO Partner to Expand Manufacturing

EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it is partnering with DELO, a leading manufacturer of industrial high-tech adhesives, in the area of wafer-level optics (WLO). Both companies, well-known for their leading roles in optical sensor manufacturing, are combining efforts to enable novel optical devices and applications, such as biometric authentication and facial

Bosch reaches milestone on the way to opening new wafer fab in Dresden

It is a milestone on the path to the chip factory of the future: at the new Bosch semiconductor fab in Dresden, silicon wafers are passing through the fully automated fabrication process for the first time. This is a key step toward the start of production operations, which is scheduled for late 2021. Manufacturing of automotive microchips will be a primary focus when the fully digital and highly connected semiconductor plant is up and running. “Chips for tomorrow’s mobility solutions and greater safety on our roads will soon be produced in Dresden. We plan to open our chip factory of the future before the year is out,” says Harald Kroeger, member of the board of management of Robert Bosch GmbH. The company already operates a semiconductor fab in Reutlingen near Stuttgart. The new wafer fab in Dresden is Bosch’s response to the surging number of areas of application for semiconductors, as well as a renewed demonstration of its commitment to Germany as a high-tech location. Bosch is investing around one billion euros in the high-tech manufacturing facility, which will be one of the most advanced wafer fabs in the world. Funding for the new building is being provided by the federal German government, and more specifically the Federal Ministry for Economic Affairs and Energy. Bosch plans to officially open its wafer fab in June 2021.

Cinotop & Micron presents “Touch Everywhere” at The International Consumer Electronics Show

The International Consumer Electronics Show (CES) will be held online due to the corona crisis and will run January 11-14 this year. For the first time, CES will take place online this year. It has always been the leading trade fair for global consumer electronics, with exhibits ranging from small chips to large airplanes and yachts. The fair covers almost all consumer electronics products and the world’s largest companies typically present their latest products and show their latest technologies here.

Essentium Introduces Industry-First Anti-Static Material To Advance Additive Manufacturing Applications In The Aerospace And Defense Industries

Chip upgrade helps miniature drones navigate

Researchers at MIT, who last year designed a tiny computer chip tailored to help miniature drones navigate, have now shrunk their chip design even further, in both size and power consumption.

Electronic Textiles Remotely Control Home Appliances

Electronic textiles could allow a person to control household appliances or computers from a distance simply by touching a wristband or other item of clothing — something that could be particularly helpful for those with limited mobility. Now researchers, reporting in ACS Nano, have developed a new type of electronic textiles that is self-powered, highly sensitive and washable.

Graphene Foam Sculpted into Conductive 3D Carbon Blocks

Rice scientists are making 3D laser-induced graphene (LIG) foam through an automated process that begins by turning the top layer of a polyimide (PI) sheet into graphene (top), stacking another layer on top (center) with ethylene glycol (EG) as a binder and then burning the top layer’s PI into graphene as well (bottom). The process is repeated as necessary. Courtesy of the Tour Group

Thin-Film Transistors Made Easy with AHPCS Shearing Blade

A flexible, durable and solvent-resistance inorganic polymer. (Allylhybridpolycarbosilane or AHPCS) was used to fabricate the microstructured AHPCS shearing blade. The wet-ability of the AHPCS micropillar surface is tunable. By controlling the shearing rate and the substrate temperature, crystal growth can occur along the moving blade.

Dialog Semiconductor Enters Growing Haptics Market

Dialog Semiconductor, a provider of highly integrated power management, AC/DC power conversion, charging, and Bluetooth® low energy technology, today unveiled the DA7280, a new Haptic Driver Integrated Circuit (IC). The device is capable of driving both ERM (Eccentric Rotating Mass) and LRA (Linear Resonant Actuators) motors

Center for Neovation in Neocity

Intensely focused on the future, the Center for Neovation, formerly known as the Florida Advanced Manufacturing Research Center (FAMRC) was designed and constructed in 24 months.

Semiconductor Manufacturing Facility Expansion

ON Semiconductor Corporation (Nasdaq: ON), driving energy efficient innovations, is excited to announce the expansion of their manufacturing facility in Rochester, New York. The site develops and manufactures image sensor devices for commercial, industrial and professional imaging applications, including machine vision, surveillance, traffic monitoring, medical and scientific imaging and photography.

New Superconductor Design allows for better control at the nanoscale

New Superconductor Design presents a better superconductor with geometric frustration. Superconductors contain tiny tornadoes of supercurrent, called vortex filaments, that create resistance when they move. This affects the way superconductors carry a current. A new superconductor design creates potential making them better for applications.

New Semiconductor Assembly Process

UCLA scientists and engineers have developed a new semiconductor assembly process. The advance could lead to much more energy-efficient transistors for electronics and computer chips, diodes for solar cells and light-emitting diodes, and other semiconductor-based devices.

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