Cleanroom Blog Articles

Cadence Announces the Acquisition of Utitec, Inc.

Cadence, Inc., a leading contract manufacturer of medical and drug delivery devices and specialty commercial products, announced today that it has acquired Utitec, Inc., a manufacturer specializing in miniature, deep drawn medical device and commercial components. Utitec is headquartered in Watertown, Conn., with an additional medical facility located in Alajuela, Costa Rica.

American Battery Factory Selects Tucson, AZ for First Battery Cell Gigafactory

American Battery Factory today announced that Tucson, AZ is the site for the first in series of battery cell gigafactories based in the United States.

ITRI Announces High Res Full-Color Micro LED Display for AR Glasses

ITRI, Taiwan’s largest and one of the world’s leading high-tech applied research institutions, today introduced the High Resolution Full-Color Micro LED Display for AR Glasses.

AlixLabs AB announces their first European patent relating to Atomic Layer Etch Pitch Splitting (APS)

AlixLabs from Lund, Sweden, has developed a new, innovative method for manufacturing semiconductor components with a high degree of packing, eliminating several steps in the semiconductor manufacturing process

Biomerics Completes Connecticut Expansion

Biomerics Completes Connecticut Expansion

Biomerics, the leading vertically integrated medical device contract manufacturer in the interventional device market, announced completion of a 26,000 sq. ft. expansion of its Monroe, CT facility. The Monroe facility is the headquarters of Biomerics’ micro-metals processing business and specializes in the design, development, and manufacture of complex micromachined and laser-processed components for the interventional robotic medical device market.

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Amkor Technology Announces Cleanroom Facility Development in Vietnam

Amkor Technology Announces Cleanroom Facility Development in Vietnam

Amkor Technology, Inc. today announced that it plans to build a state-of-the-art smart factory in Bac Ninh, Vietnam. The first phase of the new factory will focus on providing Advanced System in Package (SiP) assembly and test solutions to the world’s leading semiconductor and electronic manufacturing companies.

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