by Micron Technology, Inc.
Micron Technology, Inc., announced today it has begun volume shipments of the world’s first 176-layer NAND Universal Flash Storage (UFS) 3.1 mobile solution. Engineered for high-end and flagship phones, Micron’s discrete UFS 3.1 mobile NAND unlocks 5G’s potential with up to 75% faster sequential write and random read performance than prior generations,1 enabling downloads of two-hour 4K movies2 in as little as 9.6 seconds.
by GlobalFoundries
GlobalFoundries (GF), the global leader in feature-rich semiconductor manufacturing, today announced its expansion plans for its most advanced manufacturing facility in upstate New York over the coming years. These plans include immediate investments to address the global chip shortage at its existing Fab 8 facility as well as construction of a new fab on the same campus that will double the site’s capacity.
by ON Semiconductor
ON Semiconductor Corporation (Nasdaq: ON), driving energy efficient innovations, is excited to announce the expansion of their manufacturing facility in Rochester, New York. The site develops and manufactures image sensor devices for commercial, industrial and professional imaging applications, including machine vision, surveillance, traffic monitoring, medical and scientific imaging and photography.
