Micron Launches World’s First 176-Layer NAND in Mobile Solutions to Power Lightning-Fast 5G Experiences

Micron Launches World’s First 176-Layer NAND in Mobile Solutions to Power Lightning-Fast 5G Experiences

Micron Technology, Inc., announced today it has begun volume shipments of the world’s first 176-layer NAND Universal Flash Storage (UFS) 3.1 mobile solution. Engineered for high-end and flagship phones, Micron’s discrete UFS 3.1 mobile NAND unlocks 5G’s potential with up to 75% faster sequential write and random read performance than prior generations,1 enabling downloads of two-hour 4K movies2 in as little as 9.6 seconds.

Thin-Film Transistors Made Easy with AHPCS Shearing Blade

Thin-Film Transistors Made Easy with AHPCS Shearing Blade

A flexible, durable and solvent-resistance inorganic polymer. (Allylhybridpolycarbosilane or AHPCS) was used to fabricate the microstructured AHPCS shearing blade. The wet-ability of the AHPCS micropillar surface is tunable. By controlling the shearing rate and the substrate temperature, crystal growth can occur along the moving blade.